{"title":"AI Compute Chip from Enflame","authors":"Ryan Liu, Chuang Feng","doi":"10.1109/HCS52781.2021.9567224","DOIUrl":null,"url":null,"abstract":"DTU 1.0 SOC • 32 AI compute core, 4 clusters • 40 Data transfer engines • 4 High speed interconnects • 2 HBM2 providing 512GB/s bandwidth","PeriodicalId":246531,"journal":{"name":"2021 IEEE Hot Chips 33 Symposium (HCS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE Hot Chips 33 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HCS52781.2021.9567224","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
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