A Non-Uniform Grid Based Ground Plane Model for High Performance Nodes: The Impact of Heterogeneous Cores on Ground Voltage Gradient

N. Venkateswaran, Ravindhiran Mukundrajan, Mrigank Sharma, B. Ravi
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Abstract

With shift towards heterogeneous core architectures imminent, the uniform grid based ground plane model that is currently employed for chip-multiprocessors will no longer suf¿ce. It is practically impossible to achieve absolute zero potential at all grid nodes of the uniform ground plane model with advent of heterogeneous cores. Differential injection of current into the ground plane by different heterogeneous core partitions results in voltage gradients across the ground plane, which is detrimental to the operation of the processor. The extremely stochastic spiking activity of different cores further accentuates the problem. To overcome the problem of varying voltage distribution across the ground plane, we propose a ¿rst-ever ground plane model structured as a non-uniform RLC interconnect grid. A simulated annealing optimization is employed with parameter of ‘temperature’ as each node in the grid and impedance as the cost function ’δe’ to arrive at the non-uniform grid structure.
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基于非均匀网格的高性能节点地平面模型:异质磁芯对地电压梯度的影响
随着向异构核心架构的转变迫在眉睫,目前用于芯片多处理器的基于统一网格的地平面模型将不再适用。随着非均匀地心的出现,在均匀地平面模型的所有网格节点上实现绝对零电位实际上是不可能的。不同的异质磁芯分区向地平面注入电流的差异会导致整个地平面上的电压梯度,这对处理器的运行是不利的。不同地核的极端随机尖峰活动进一步加剧了这个问题。为了克服整个接地面电压分布变化的问题,我们首次提出了一个非均匀RLC互连网格结构的接地面模型。采用模拟退火优化,以温度参数作为网格中的每个节点,以阻抗为代价函数δe,得到非均匀网格结构。
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