Electrical resistivity of liquid CuSn, CuSnBi, CuSnBiIn, CuSnBiInCd alloys of equiatomic compositions

PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2019): Proceedings of the VI International Young Researchers’ Conference Pub Date : 2019-12-06 DOI:10.1063/1.5134167

O. Chikova, V. Il’in, V. Tsepelev, V. V’yukhin

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Abstract

The resistivity of liquid CuSn,CuSnBi, CuSnBiIn, CuSnBiInCd alloys of equiatomic compositions are measured using the rotating magnetic field method to obtain information on their liquid structures. The alloys of equiatomic composition we considered as the high-entropy alloys. The results are discussed in the frame of a microheterogeneous structure of a metallic melt. A conclusion is made about the character of the modification of temperature dependence of the resistivity of liquid alloy due this microheterogeneous structure. All the investigated alloys demonstrated the change in the temperature coefficient of the resistivity for heating and cooling. These changes determined the temperature of destruction the microheterogeneous structure of a metallic melt (T*). The value of temperature T* for all alloys was 1070 K (800 °C). The change in the temperature coefficient of the resistivity of the alloys on heating to 1070 K (800 °C) is interpreted using the Nagel-Tauc model.

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等原子成分液态CuSn、CuSnBi、CuSnBiIn、CuSnBiInCd合金的电阻率

采用旋转磁场法测量了等原子成分CuSn、CuSnBi、CuSnBiIn、CuSnBiInCd等合金的液态电阻率，获得了其液态结构信息。等原子组成的合金被认为是高熵合金。结果在金属熔体微非均相结构的框架内进行了讨论。总结了这种微非均相组织对液态合金电阻率温度依赖性改变的特点。所有合金在加热和冷却过程中均表现出电阻率温度系数的变化。这些变化决定了金属熔体微非均相结构的破坏温度(T*)。所有合金的温度T*值均为1070 K(800℃)。用nagel - tac模型解释了合金在加热到1070k(800℃)时电阻率温度系数的变化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2019): Proceedings of the VI International Young Researchers’ Conference

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