Investigations on Steel as Low Cost Substrate for Low Frequency Patch Antenna

2019 International Conference on Communication and Electronics Systems (ICCES) Pub Date : 2019-07-01 DOI:10.1109/ICCES45898.2019.9002402

K. K. Lakshmi, B. Sabarish Narayanan

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引用次数: 2

Abstract

Industry uses different types of materials as microstrip substrates. This paper introduces steel, and thus explores its scope as a microstrip substrate. Its metallic nature creates a barrier, from using it as substrate. A low cost rectangular microstrip patch antenna using a multilayer substrate is proposed here. Martensitic steel of grade 440C and thermocol forms a layered substrate. The magnetic properties of steel and dielectric properties of thermocol helps for achieving good antenna parameters. Designed patch antenna has noticeable return loss of −24dB in 400MHz. Also directional radiation pattern with gain of 0.3dB has been obtained. It shows a narrow bandwidth of 3MHz which is due to the conductivity of steel. VSWR obtained is 1.13 which shows a tremendous matching with transmission line connected to it. The results shows that, newly introduced multilayer material can be used as microstrip substrate for low frequency structures. It can produce almost the same results, which a local substrate can. It can be used for wireless charging using low frequency and thus an application of RF energy harvesting.

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钢作为低成本低频贴片天线衬底的研究

工业上使用不同类型的材料作为微带基板。本文介绍了钢，从而探讨了钢作为微带衬底的范围。它的金属性质造成了屏障，不能用作基材。本文提出了一种采用多层衬底的低成本矩形微带贴片天线。440C和温冷马氏体钢形成层状基体。钢的磁性能和热电偶的介电性有助于获得良好的天线参数。设计的贴片天线在400MHz频段回波损耗为- 24dB。获得了增益为0.3dB的定向辐射方向图。它显示出3MHz的窄带宽，这是由于钢的导电性。得到的驻波比为1.13，与与之相连的传输线有很大的匹配。结果表明，新引入的多层材料可作为低频结构的微带衬底。它可以产生和本地底物几乎相同的结果。它可以用于使用低频的无线充电，从而用于射频能量收集的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 International Conference on Communication and Electronics Systems (ICCES)

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