{"title":"Design for manufacturability in submicron domain","authors":"Wojciech Maly, H. Heineken, J. Khare, P. Nag","doi":"10.1109/ICCAD.1996.571365","DOIUrl":null,"url":null,"abstract":"Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional \"design rules\" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.","PeriodicalId":408850,"journal":{"name":"Proceedings of International Conference on Computer Aided Design","volume":"197 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Conference on Computer Aided Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1996.571365","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 55
Abstract
Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.
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