Performance Analysis of Silicon and III-V Channel Material for Junctionless-Gate-All-Around Field Effect Transistor

M. F. M. Rasol, F. K. A. Hamid, Z. Johari, R. Arsat, M. Yusoff
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引用次数: 1

Abstract

The scaling down of device dimension beyond the Moore’s Law era have introduce the use of new material and device architecture. This paper reports a comparative study between Silicon and III-V junctionless-gate-all-around (JGAA) transistor as an alternative approach to overcome the short channel effects (SCEs). The device is simulated and characterized using TCAD Sentaurus. The III-V semiconductor channel material applied are Gallium Nitrite (GaN) and Gallium Arsenide (GaAs). The device electrical performance was compared in terms of the threshold voltage (Vth), subthreshold slope (SS), drain current (Ion) and leakage current (Ioff) extracted from the current-voltage characteristics. The results demonstrated a feasibility of using advanced device architecture using non-silicon material for future nanoelectronics application.
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无结栅全场效应晶体管硅及III-V沟道材料的性能分析
超越摩尔定律时代的器件尺寸缩小引入了新材料和器件架构的使用。本文报道了硅晶体管和III-V型无结栅全能晶体管(JGAA)作为克服短通道效应(SCEs)的替代方法的比较研究。利用TCAD Sentaurus对该装置进行了仿真和表征。应用的III-V型半导体通道材料是亚硝酸盐镓(GaN)和砷化镓(GaAs)。根据电流-电压特性提取的阈值电压(Vth)、亚阈值斜率(SS)、漏极电流(Ion)和漏电流(Ioff)对器件的电性能进行比较。结果表明,在未来的纳米电子学应用中,使用非硅材料的先进器件架构是可行的。
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