Jong-Hoi Kim, Joong-Seon Choe, K. Choi, C. Youn, Duk-Jun Kim, Yong-Hwan Kwon, E. Nam
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引用次数: 0
Abstract
We present a hybrid-integrated coherent receiver module using a chip-to-chip bonding technology to integrate a spot-size converter integrated photodiode array chip and an optical hybrid chip using a silica-based PLC technology.
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