Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

H. Kristiansen, Z.L. Zhang, J. Liu
{"title":"Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive","authors":"H. Kristiansen, Z.L. Zhang, J. Liu","doi":"10.1109/ISAPM.2005.1432077","DOIUrl":null,"url":null,"abstract":"Metal coated small (micron sized) polymer particles are used in developing anisotropic conductive adhesives (ACA). The mechanical properties of polymer particles are of crucial importance both to assembly process and the reliability of ACA. Tn this paper we present a method to determine the mechanical properties of polymer sphere particles by using inverse indentation test - soft elastic sphere against rigid flat. Finite element analyses have been carried out to study the large deformation contact between the sphere particle and a rigid flat. The classical Hertz solution works only for small sphere deformation. A modification has been made to the Hertz contact force-displacement solution and an approximate equation is presented. A capacitance based experimental setup for particle indentation has been built. The proposed method has been applied to determine the elastic properties of typical polymer particles used for conductive adhesives. For the metal plated polymer particles tested, it has been found that a linear elastic model seems to hold for a large range of deformation.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432077","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

Metal coated small (micron sized) polymer particles are used in developing anisotropic conductive adhesives (ACA). The mechanical properties of polymer particles are of crucial importance both to assembly process and the reliability of ACA. Tn this paper we present a method to determine the mechanical properties of polymer sphere particles by using inverse indentation test - soft elastic sphere against rigid flat. Finite element analyses have been carried out to study the large deformation contact between the sphere particle and a rigid flat. The classical Hertz solution works only for small sphere deformation. A modification has been made to the Hertz contact force-displacement solution and an approximate equation is presented. A capacitance based experimental setup for particle indentation has been built. The proposed method has been applied to determine the elastic properties of typical polymer particles used for conductive adhesives. For the metal plated polymer particles tested, it has been found that a linear elastic model seems to hold for a large range of deformation.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
各向异性导电胶粘剂用金属包覆聚合物球的力学性能表征
金属包覆的小(微米级)聚合物颗粒用于开发各向异性导电胶(ACA)。聚合物颗粒的力学性能对装配过程和ACA的可靠性至关重要。本文提出了一种用反压痕试验测定高分子球颗粒力学性能的方法——软弹性球对刚性平面的压痕试验。采用有限元方法研究了球面颗粒与刚性平面之间的大变形接触。经典的赫兹解只适用于小的球体变形。对赫兹接触力-位移解进行了修正,得到了近似方程。建立了基于电容的粒子压痕实验装置。所提出的方法已用于测定用于导电胶粘剂的典型聚合物颗粒的弹性性能。对于测试的金属镀聚合物颗粒,已经发现线性弹性模型似乎适用于大范围的变形。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Improving die attach adhesion on metal leadframes via episulfide chemistry The metallic nickel inserted p/sup -//p/sup +/ Si substrate used for RF crosstalk reduction in mixed signal ICs Effect of laser welding sequence on WIAD in packaging of dual-in-line laser modules Effect of underfill materials on Pb-free flip chip package reliability Microstructure evolution of tin under electromigration studied by synchrotron X-ray micro-diffraction
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1