Metal interference analysis and design rules of on-chip antennas for wireless interconnect

Xiaowei He, Minxuan Zhang, Jinwen Li, Shaoqing Li
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Abstract

The influence of on-chip metal interconnections, power grids, heat sink together with packaging, and metal dummy fills on the transmission characteristics of a 2mm-long integrated dipole antenna pair has been investigated in this paper. These metal structures and placements have been classified and particular simulations are performed to explore the interference effects of neighboring various metal structures on transmission gain, phase, impedance and radiation pattern for on-chip dipole antenna pair. By virtue of the experimental results and analyses, several experiential linear expressions for antenna pair gain and phase in interference circumstances are obtained using numerical fit. A set of design rules is concluded accordingly for guiding on-chip antenna layout and design targeting wireless interconnect.
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无线互连片上天线的金属干扰分析及设计原则
本文研究了片上金属互连、电网、散热器连同封装、金属假人填充等因素对2mm长集成偶极子天线对传输特性的影响。对这些金属结构和放置位置进行了分类,并进行了具体的仿真,以探讨相邻的各种金属结构对片上偶极子天线对传输增益、相位、阻抗和辐射方向图的干扰影响。根据实验结果和分析,通过数值拟合得到了干扰条件下天线对增益和相位的几个经验线性表达式。据此总结出一套指导片上天线布局和无线互联设计的设计原则。
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