{"title":"An ultra-compact SP4T cellular antenna switch in 3.3V CMOS thick-film SOI","authors":"V. Blaschke, A. Unikovski, R. Zwingman","doi":"10.1109/IEEE-IWS.2013.6616791","DOIUrl":null,"url":null,"abstract":"This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.","PeriodicalId":344851,"journal":{"name":"2013 IEEE International Wireless Symposium (IWS)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Wireless Symposium (IWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEEE-IWS.2013.6616791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
