Standard measuring device for thickness of silicon wafer based on laser compensation system

Abstract

Standard silicon wafer, which is standard instruments for semiconductors, large scale integrated circuits and photovoltaic industries, is the internationally accepted physical standard. The thickness of silicon wafer is directly related to the performance of integrated devices or performance of photoelectric conversion. In this paper, a standard measuring device for thickness of silicon wafer based on double-layer embedded table is introduced. With sensor compensation technology based on laser compensation principle, the inductance used in measurement is linearly compensated, resulting in improving the accuracy of standard silicon wafer thickness measurement. By measuring the standard silicon wafers with different diameter and thickness, the effectiveness of the method is verified.