K. Ito, K. Ueda, K. Nakano, K. Hanaoka, S. Chabata
{"title":"Electricity current heating and bondable insulation system for hermetic motor","authors":"K. Ito, K. Ueda, K. Nakano, K. Hanaoka, S. Chabata","doi":"10.1109/EIC.1985.7458609","DOIUrl":null,"url":null,"abstract":"Fujikura has carried out to shorten the bonding time of SBWS thermosetting system by using current heating method for hermetic motor processing than external curing by oven that is widely now used. This report relates to heating methods and their properties in hermetic motor insulation. From the results, Fujikura gets a conclusion that the bonding and curing rate of current heating system is approximately 30 times as same as that of conventional external heating system without decreasing the reliability as bondable insulation system for hermetic use.","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1985-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1985 EIC 17th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1985.7458609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Fujikura has carried out to shorten the bonding time of SBWS thermosetting system by using current heating method for hermetic motor processing than external curing by oven that is widely now used. This report relates to heating methods and their properties in hermetic motor insulation. From the results, Fujikura gets a conclusion that the bonding and curing rate of current heating system is approximately 30 times as same as that of conventional external heating system without decreasing the reliability as bondable insulation system for hermetic use.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
