Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak
{"title":"EMI radiation physics using generalized characteristic mode (GCM) analysis with loss for practical structures","authors":"Y. S. Cao, Xu Wang, Yansheng Wang, Lijun Jiang, A. Ruehli, Shiquan He, Huapeng Zhao, Jun Hu, J. Fan, J. Drewniak","doi":"10.1109/EPEPS.2017.8329764","DOIUrl":null,"url":null,"abstract":"Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.","PeriodicalId":397179,"journal":{"name":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2017.8329764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.
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