Aligning system for a pick-and-place BGA soldering equipment

Abstract

The necessity to have semiconductor components inside mobile, thinner and lighter devices, has created a new form to solder these electronics components to their main boards. This work for soldering superficial mounting semiconductors has become a precision task. For that reason, nowadays, the construction of equipements to pick and place semiconductors, has got an important attention. A high accuracy aligning systems are required in those equipements. In this work, an aligning prototype for superficial soldering systems is presented, using a laser devise with a set of mirrors, and an aligning mechanic system, which is low-cost, modular and upgradeable.