Splendidly blended: a machine learning set up for CDU control

C. Utzny
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引用次数: 8

Abstract

As the concepts of machine learning and artificial intelligence continue to grow in importance in the context of internet related applications it is still in its infancy when it comes to process control within the semiconductor industry. Especially the branch of mask manufacturing presents a challenge to the concepts of machine learning since the business process intrinsically induces pronounced product variability on the background of small plate numbers. In this paper we present the architectural set up of a machine learning algorithm which successfully deals with the demands and pitfalls of mask manufacturing. A detailed motivation of this basic set up followed by an analysis of its statistical properties is given. The machine learning set up for mask manufacturing involves two learning steps: an initial step which identifies and classifies the basic global CD patterns of a process. These results form the basis for the extraction of an optimized training set via balanced sampling. A second learning step uses this training set to obtain the local as well as global CD relationships induced by the manufacturing process. Using two production motivated examples we show how this approach is flexible and powerful enough to deal with the exacting demands of mask manufacturing. In one example we show how dedicated covariates can be used in conjunction with increased spatial resolution of the CD map model in order to deal with pathological CD effects at the mask boundary. The other example shows how the model set up enables strategies for dealing tool specific CD signature differences. In this case the balanced sampling enables a process control scheme which allows usage of the full tool park within the specified tight tolerance budget. Overall, this paper shows that the current rapid developments off the machine learning algorithms can be successfully used within the context of semiconductor manufacturing.
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完美融合:为CDU控制设置的机器学习
随着机器学习和人工智能的概念在互联网相关应用的背景下变得越来越重要,它在半导体行业的过程控制方面仍处于起步阶段。特别是掩模制造的分支对机器学习的概念提出了挑战,因为业务流程本质上在小号牌的背景下诱发了明显的产品可变性。在本文中,我们提出了一种机器学习算法的架构设置,该算法成功地处理了掩模制造的需求和缺陷。详细介绍了这种基本设置的动机,并对其统计性质进行了分析。为掩模制造设置的机器学习包括两个学习步骤:初始步骤识别和分类过程的基本全局CD模式。这些结果构成了通过平衡采样提取优化训练集的基础。第二个学习步骤使用这个训练集来获得由制造过程引起的局部和全局CD关系。使用两个生产动机的例子,我们展示了这种方法如何灵活和强大到足以处理口罩制造的严格要求。在一个示例中,我们展示了如何将专用协变量与CD地图模型的空间分辨率增加结合使用,以处理掩膜边界的病理CD效应。另一个示例显示了如何设置模型以启用处理特定于工具的CD签名差异的策略。在这种情况下,平衡取样实现了一个过程控制方案,该方案允许在指定的严格公差预算内使用整个刀具库。总体而言,本文表明,当前机器学习算法的快速发展可以成功地应用于半导体制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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