A Comprehensive CFD Study of Tile Flow Rate Distribution in a Compact Data Center Laboratory

Beichao Hu, Cheng-Xian Lin, D. Patel, Y. Joshi, J. Vangilder, M. Seymour
{"title":"A Comprehensive CFD Study of Tile Flow Rate Distribution in a Compact Data Center Laboratory","authors":"Beichao Hu, Cheng-Xian Lin, D. Patel, Y. Joshi, J. Vangilder, M. Seymour","doi":"10.1109/ITherm45881.2020.9190300","DOIUrl":null,"url":null,"abstract":"Cooling air in data center is most commonly supplied by Computer Room Air Handler (CRAH) units through a raised-floor plenum and is eventually delivered through perforated tiles into the computer room. The flow rate distribution on perforated tiles is crucial to the amount of cooling air delivered to rack units in the cold aisle, which dominates the cooling effect of the entire computer room. Among many factors affecting the flow rate distribution, plenum modeling is one of the most important factors. Computational Fluid Dynamics (CFD) tools are usually applied to predict the temperature and velocity profile in data centers. However, most of literatures in the past focused on perforated tile modeling and server modeling in the computer room. Plenum was usually intentionally neglected and flow rate on the perforated tiles were specified as boundary conditions. It was also reported [1] that the prediction of the flow rate distribution was difficult. This paper studies the tile flow rate distribution based on CFD simulation. The CFD result was then compared with the result of an experiment taken in Georgia Tech.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"3999 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITherm45881.2020.9190300","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Cooling air in data center is most commonly supplied by Computer Room Air Handler (CRAH) units through a raised-floor plenum and is eventually delivered through perforated tiles into the computer room. The flow rate distribution on perforated tiles is crucial to the amount of cooling air delivered to rack units in the cold aisle, which dominates the cooling effect of the entire computer room. Among many factors affecting the flow rate distribution, plenum modeling is one of the most important factors. Computational Fluid Dynamics (CFD) tools are usually applied to predict the temperature and velocity profile in data centers. However, most of literatures in the past focused on perforated tile modeling and server modeling in the computer room. Plenum was usually intentionally neglected and flow rate on the perforated tiles were specified as boundary conditions. It was also reported [1] that the prediction of the flow rate distribution was difficult. This paper studies the tile flow rate distribution based on CFD simulation. The CFD result was then compared with the result of an experiment taken in Georgia Tech.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
小型数据中心实验室瓷砖流速分布的综合CFD研究
数据中心的冷却空气通常由机房空气处理机(CRAH)通过高架地板通风柜提供,最终通过穿孔砖输送到机房。穿孔砖上的流速分布对冷通道中机架单元的冷却风量至关重要,它主导着整个机房的冷却效果。在影响流量分布的诸多因素中,充气室造型是最重要的因素之一。计算流体动力学(CFD)工具通常用于预测数据中心的温度和速度分布。然而,过去的文献大多集中在计算机机房的穿孔瓦建模和服务器建模上。通常故意忽略静压,并指定穿孔瓦上的流速作为边界条件。也有报道称,流量分布的预测是困难的。本文研究了基于CFD模拟的瓷砖流量分布。然后将CFD结果与佐治亚理工学院的实验结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Thermal Sensor Placement based on Meta-Model Enhancing Observability and Controllability A Cascaded Multi-Core Vapor Chamber for Intra-Lid Heat Spreading in Heterogeneous Packages Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 2: Corrosion Reliability Testing and Failure Model A Reduced-order Model for Analyzing Heat Transfer in a Thermal Energy Storage Module Systematic Approach in Intel SoC (System on Chip) Thermal Solution Design using CFD (Computational Fluid Dynamics) Simulation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1