Surface degradation properties of the polymer composite

J.K. Park, B. Kim, D.C. Lee
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引用次数: 1

Abstract

In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay respectively. In XPS spectrum to analyze surface chemical structures, the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by oxygen groups and the increase of unsaturated double bond in carbon chains. In the chemical change of discharge treatment, a lot of side-chains comprising carboxyl radical occurred on the treated surface and the hydrophilicity increased as time elapsed.
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聚合物复合材料的表面降解性能
在本研究中,模拟了任意的热和放电处理,以找出用于PCB衬底的聚合物表面降解的起始和过程。随着接触角的增大和表面电位衰减的增大,热处理使表面变为疏水表面。在分析表面化学结构的XPS光谱中,热处理过程中疏水性的增加源于氧基引起的侧链的不断减少和碳链中不饱和双键的增加。在排放处理的化学变化过程中,处理表面产生大量含有羧基自由基的侧链,并且随着时间的推移亲水性增强。
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