H. Alhattab, Mahir A. Albaghdadi, Raed S. Hashim, Ali H. Ali
{"title":"Design of micro heat sink for power transistor by using CFD","authors":"H. Alhattab, Mahir A. Albaghdadi, Raed S. Hashim, Ali H. Ali","doi":"10.1109/AIC-MITCSA.2016.7759948","DOIUrl":null,"url":null,"abstract":"Different geometrical pattern of micro pin fins heat sinks for TO-220 power transistor has been modeled by using academic edition of multi-physics computational fluid dynamic (CFD) package COMSOL v 4.4 to enhance the heat transfer of power transistor. To Comparing COMSOL model results with experimental results, thermocouples sensors (type: FLUKE 87V, USA) and infrared camera (FLIR E50) were used. Experimental results showed that the model of this work has a high reliability. The assembled micro pin fins heat sinks modeled to the power transistor provides an efficient and economical improvement in thermal transferring, around 11.6oC has been reduced by modeling a heat sink with square, rectangular and hydrofoil micro pin fins compared to smooth heat sink.","PeriodicalId":315179,"journal":{"name":"2016 Al-Sadeq International Conference on Multidisciplinary in IT and Communication Science and Applications (AIC-MITCSA)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 Al-Sadeq International Conference on Multidisciplinary in IT and Communication Science and Applications (AIC-MITCSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AIC-MITCSA.2016.7759948","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
Different geometrical pattern of micro pin fins heat sinks for TO-220 power transistor has been modeled by using academic edition of multi-physics computational fluid dynamic (CFD) package COMSOL v 4.4 to enhance the heat transfer of power transistor. To Comparing COMSOL model results with experimental results, thermocouples sensors (type: FLUKE 87V, USA) and infrared camera (FLIR E50) were used. Experimental results showed that the model of this work has a high reliability. The assembled micro pin fins heat sinks modeled to the power transistor provides an efficient and economical improvement in thermal transferring, around 11.6oC has been reduced by modeling a heat sink with square, rectangular and hydrofoil micro pin fins compared to smooth heat sink.
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