{"title":"EHF Power Generation for Tactical, Mobile and Strategic MILSATCOM Terminals","authors":"K. Farber, J. Pan, R. Varley","doi":"10.1109/MILCOM.1982.4806022","DOIUrl":null,"url":null,"abstract":"EHF MILSATCOM earth terminals are rapidly becoming a reality. EHF power sources (transmitters) are both a high technology and large production cost element of most terminal implementation approaches. To provide the MILSATCOM community with a current technology status, an industry survey has been conducted among several governmental procurement organizations and potential industry suppliers. The survey, as presented in this paper, addresses specific needs of planned terminals at 45 and 30 GHz. Both devices and high-power amplifiers (HPA's) are investigated in the survey, with particular attention given to near-term requirements. The paper considers both TWT and solid-state devices available now as developmental products. IMPATT diodes provide the most extensive effort to date in solid-state device technology, with power FET's offering a long-term solution with some inherent circuit combining advantages. IMPATT diodes are under development applying silicon (Si), gallium arsenide (GaAs), and indium phosphide (InP), materials to device requirements on a frequency selective basis. Current TWT technology is centered around coupled cavity and wound-helix slow-circuit approaches. A brief review of major EHF MILSATCOM earth terminal requirements is presented as it relates to the transmitter power and platform constraints.","PeriodicalId":179832,"journal":{"name":"MILCOM 1982 - IEEE Military Communications Conference - Progress in Spread Spectrum Communications","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1982-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"MILCOM 1982 - IEEE Military Communications Conference - Progress in Spread Spectrum Communications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MILCOM.1982.4806022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
EHF MILSATCOM earth terminals are rapidly becoming a reality. EHF power sources (transmitters) are both a high technology and large production cost element of most terminal implementation approaches. To provide the MILSATCOM community with a current technology status, an industry survey has been conducted among several governmental procurement organizations and potential industry suppliers. The survey, as presented in this paper, addresses specific needs of planned terminals at 45 and 30 GHz. Both devices and high-power amplifiers (HPA's) are investigated in the survey, with particular attention given to near-term requirements. The paper considers both TWT and solid-state devices available now as developmental products. IMPATT diodes provide the most extensive effort to date in solid-state device technology, with power FET's offering a long-term solution with some inherent circuit combining advantages. IMPATT diodes are under development applying silicon (Si), gallium arsenide (GaAs), and indium phosphide (InP), materials to device requirements on a frequency selective basis. Current TWT technology is centered around coupled cavity and wound-helix slow-circuit approaches. A brief review of major EHF MILSATCOM earth terminal requirements is presented as it relates to the transmitter power and platform constraints.