{"title":"Liquid cooling for 3D-ICs","authors":"Bing Shi, Ankur Srivastava","doi":"10.1109/IGCC.2011.6008576","DOIUrl":null,"url":null,"abstract":"This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.","PeriodicalId":306876,"journal":{"name":"2011 International Green Computing Conference and Workshops","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Green Computing Conference and Workshops","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IGCC.2011.6008576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.
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