The New Way of Estimating the PCB's Lifetime of Fatigue using the Principle of Linear Accumulated Damage in Various Boundary Condition

Abstract

Modern electronic units during operation are subjected to various types of stress, such as vibration and shock. Vibration damages the printed circuit board due to stress. We proposed a methodology that differs from the traditional methods that did not address the relationship between stress and fixation methods. Previous studies on predicting the stress and fatigue life of the structure have been improved using the theory of linear cumulative damage and the three syllables proposed by Steinberg which did not take into account the type of installation and its effects on stress distribution on PCB. We have shown a close relationship between stress and fixing methods that It was not previously searched for. The methodology of reverse engineering in the design using modelling by Creo parametric program has tested four limit conditions to determine which method of fixation of the PCB with the least stress and determine the fatigue life through mathematical equations, this is before the installation process, thus reducing the cost and time.