{"title":"Cu-based alloys for 3DP by melt extrusion process","authors":"C. Chou, W. C. Wei, B. H. Liu, A. B. Wang, R. Luo","doi":"10.1109/ICIT.2016.7474918","DOIUrl":null,"url":null,"abstract":"A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100°C-extrusion capability, high heating rate (930 °C/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.","PeriodicalId":116715,"journal":{"name":"2016 IEEE International Conference on Industrial Technology (ICIT)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Conference on Industrial Technology (ICIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIT.2016.7474918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100°C-extrusion capability, high heating rate (930 °C/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed.
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