{"title":"Low-Profile Wideband 32×32 Plate Array Antenna with 24.2% Relative Bandwidth Using Diffusion Bonding Techniques","authors":"Bin Wang, Y. Cheng","doi":"10.1109/COMPEM.2018.8496523","DOIUrl":null,"url":null,"abstract":"In this paper, a low-profile wideband 32×32 array antenna is proposed for E-band wireless applications. It covers the frequency band from 69 GHz to 88 GHz. A quadruple-ridge horn is used as the radiating part because of its wideband and low-profile characteristics. Besides, the whole array is fed by a series of E-plane and H-plane parallel-fed power dividers. The total efficiency of the array is about 60% and the peak gain of the array is 38.9 dBi. The array antenna can be fabricated by the diffusion bonding technique. Such an array has a relatively simpler configuration compared with other existing designs, which is able to simplify the design process and shorten the design cycle. Besides, the wider bandwidth of this array can guarantee the fabrication reliability and tolerance, while increasing the production yield.","PeriodicalId":221352,"journal":{"name":"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Computational Electromagnetics (ICCEM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMPEM.2018.8496523","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper, a low-profile wideband 32×32 array antenna is proposed for E-band wireless applications. It covers the frequency band from 69 GHz to 88 GHz. A quadruple-ridge horn is used as the radiating part because of its wideband and low-profile characteristics. Besides, the whole array is fed by a series of E-plane and H-plane parallel-fed power dividers. The total efficiency of the array is about 60% and the peak gain of the array is 38.9 dBi. The array antenna can be fabricated by the diffusion bonding technique. Such an array has a relatively simpler configuration compared with other existing designs, which is able to simplify the design process and shorten the design cycle. Besides, the wider bandwidth of this array can guarantee the fabrication reliability and tolerance, while increasing the production yield.
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