Micromachined on-wafer probes

T. Reck, Lihan Chen, Chunhu Zhang, C. Groppi, Haiyong Xu, A. Arsenovic, N. S. Barker, A. Lichtenberger, R. Weikle
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引用次数: 30

Abstract

A micromachined on-wafer probe is designed, fabricated and measured at W-Band as a proof of concept for probes operating at sub-millimeter wavelengths. A fabrication process is developed to create devices that combine a waveguide probe with a GSG probe tip on a 15 µm silicon substrate. This device is housed in a metal machined waveguide block that provides mechanical support for the probe and connection to a waveguide flange. Load-cell measurements show a DC contact resistance below 0.07 Ω with a force of 1 mN. A two-tier TRL calibration characterizes the operation of the electromagnetic design and an insertion loss of 1.75 dB is achieved; this is comparable with commercial probes operating in the same band.
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微加工晶圆探头
在w波段设计、制造和测量了微机械晶圆上探头,作为亚毫米波长探头工作的概念证明。开发了一种制造工艺,用于创建将波导探针与GSG探针尖端结合在15 μ m硅衬底上的器件。该装置安装在金属加工波导块中,为探头提供机械支撑,并连接到波导法兰。测压元件测量结果显示,直流接触电阻低于0.07 Ω,力为1mn。两层TRL校准表征了电磁设计的运行,并实现了1.75 dB的插入损耗;这与在同一频段工作的商用探测器相当。
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