{"title":"A 10kV/200A SiC MOSFET module with series-parallel hybrid connection","authors":"Q. Xiao, Zezheng Dong, Xinke Wu, Kuang Sheng","doi":"10.1109/PEAC.2014.7037870","DOIUrl":null,"url":null,"abstract":"In this paper, a high voltage SiC MOSFET module with series-parallel hybrid topology is presented and analyzed. The module consists of two uniform parts in parallel and each of the part includes three sub-parts in series. The sub-part contains three primary parts connected in string where each of these parts has a parallel of two SiC MOSFETs. These SiC MOSFETs are divided into six sub-modules, which are driven by a common driving signal. A 10kV/200A SiC MOSFETs module is fabricated based on this hybrid topology with thirty-six 1200V/40A SiC MOSFET chips. The dynamic switching behavior of the module is tested and analyzed at 5400V/200A with a switching speed of 440ns in turn-on process and 250ns in turn-off process.","PeriodicalId":309780,"journal":{"name":"2014 International Power Electronics and Application Conference and Exposition","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Power Electronics and Application Conference and Exposition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PEAC.2014.7037870","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, a high voltage SiC MOSFET module with series-parallel hybrid topology is presented and analyzed. The module consists of two uniform parts in parallel and each of the part includes three sub-parts in series. The sub-part contains three primary parts connected in string where each of these parts has a parallel of two SiC MOSFETs. These SiC MOSFETs are divided into six sub-modules, which are driven by a common driving signal. A 10kV/200A SiC MOSFETs module is fabricated based on this hybrid topology with thirty-six 1200V/40A SiC MOSFET chips. The dynamic switching behavior of the module is tested and analyzed at 5400V/200A with a switching speed of 440ns in turn-on process and 250ns in turn-off process.
本文提出并分析了一种串并联混合拓扑的高压SiC MOSFET模块。该模块由两个均匀并联的部分组成,每个部分由三个串联的子部分组成。子部件包含三个以字符串连接的主要部件,其中每个部件都有两个SiC mosfet的并联。这些SiC mosfet分为六个子模块,由一个共同的驱动信号驱动。基于这种混合拓扑结构,使用36个1200V/40A SiC MOSFET芯片制造了10kV/200A SiC MOSFET模块。测试和分析了该模块在5400V/200A电压下的动态开关性能,开关速度分别为440ns和250ns。