Shock Performance Enhancement of a Container for Rack Server

Abstract

Electronic devices suffer from many different types of shock environments. Especially during transportation, hugely large impacts and amplified shock accelerations are transmitted to electronic devices and container, resulting in mechanical failure of the electronic components such as solder-joint failures, chip-cracking and pad cratering, etc. In this paper, we did a container design for rack server in order to increase its shock performance. The foam packaging with different structures were investigated for rack server which can protect rack server in good condition during transportation. Explicit finite element dynamic analysis was performed to improve the shock container. Based on the numerical model, the parametric study was conducted regarding the structure and thickness of foam packaging.