Via optimization for next generation speeds

Siang Chen, C. Chen, Chun-Lin Liao, James Chen, Tzong-Lin Wu, B. Mutnury
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引用次数: 8

Abstract

Optimizing via placement is becoming important as signaling speeds increase for next generation interconnects. Random placement of ground (GND) return path vias next to signal vias would result in less than optimal performance of an interconnect. It will result in resonances in insertion loss at higher frequencies. In this paper, a methodology for optimal placement of GND vias is proposed that will not only decrease the resonances in insertion loss but also minimize the crosstalk between adjacent differential vias.
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通过优化下一代的速度
随着下一代互连信号传输速度的提高,通过放置进行优化变得越来越重要。在信号过孔旁边随机放置地(GND)返回路径过孔将导致互连性能低于最佳。这将导致插入损耗在较高频率下产生共振。在本文中,提出了一种最佳放置GND过孔的方法,该方法不仅可以减少插入损耗中的谐振,还可以最大限度地减少相邻差分过孔之间的串扰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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