Technical issues with multichip module packaging

[Proceedings] NTC-92: National Telesystems Conference Pub Date : 1992-05-19 DOI:10.1109/NTC.1992.267914

B. Mcwilliams, J. Demmin

引用次数: 7

Abstract

It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed.<>

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多芯片模块封装的技术问题

本文断言，多芯片模块(mcm)提供了一种解决方案，以满足20世纪90年代对成本效益高的高性能封装的需求，并提供了对最佳互连技术选择的见解。讨论了不同类型的mcm互连基板，认为共烧陶瓷和薄膜互连基板最适合用于要求高互连密度的应用。还详细讨论了与封装mcm相关的问题，重点放在当前的实现上。最后，对nCHIP生产的薄膜MCM技术的应用进行了综述。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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[Proceedings] NTC-92: National Telesystems Conference

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