Mechanics of Polishing

V. H. Bulsara, Y. Ahn, S. Chandrasekar, T. Farris
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引用次数: 49

Abstract

A model has been developed to determine the number and sizes of abrasive particles involved in material removal in polishing, and the forces acting on these particles. The effect of particle size on these parameters has been simulated for a range of particle sizes. It is shown that when polishing with abrasive powders having relatively broad size distributions, only a very small percentage of the particles are involved in material removal. Further, these particles are comprised of the larger particles occurring in the tail end of the particle size distribution. The average force on a particle is found to be in the range of 5–200 mN under typical polishing conditions, which is of the order of loads used in micro-indentation hardness testing. These predictions of the model are consistent with observations pertaining to polished surfaces and the polishing process.
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抛光机械
已开发出一种模型,用于确定抛光过程中材料去除所涉及的磨料颗粒的数量和尺寸,以及作用在这些颗粒上的力。针对一系列颗粒大小,模拟了颗粒大小对这些参数的影响。结果表明,当使用粒度分布相对较广的研磨粉进行抛光时,只有很小一部分颗粒参与材料去除。此外,这些颗粒由粒度分布尾端的较大颗粒组成。在典型的抛光条件下,颗粒受到的平均力在 5-200 mN 之间,与微压痕硬度测试中使用的载荷相当。模型的这些预测与抛光表面和抛光过程的观测结果一致。
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