In-line wideband contactless GrooveGap to microstrip transition with PMC packaging for MMIC integration in gap waveguide technology

Abstract

A contactless, in-line, wideband and low-loss micro strip to GrooveGap waveguide transition operating at X-band is presented. The principle of operation is based on transforming EM fields from the SIW to the RidgeGap waveguide mode via near field electromagnetic coupling. This is advantageous, since the proposed solution avoids the use of metal contact between the SIW and one of the waveguide parts. Furthermore, metamaterial-based gap waveguide technology provides a resonance-free packaging solution for the integrated MMIC amplifier. It is the first time a transition that also provides the packaging of the active component is designed. Our device works on X-band due to present test equipment limitations, but it can be scaled to mm-wave frequencies and beyond.