System level interconnect electrical performance characterization

T. Su, J. Hsu, Kai Xiao, Y. L. Li
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Abstract

In PC/Server industry, simulation process is usually separated into pre-layout and post-layout phase. The pre-layout simulation focus in finding the solution space or choosing a better topology [1], [2]. For post-layout simulation, extracting 3 or 5 pairs of the channel model and conducting the simulation analysis is widely used. However, it requires a basic understanding of the layout. Otherwise the channel which is extracted may not be the best one to represent the worst scenario in the reality. The system level interconnect electrical performance characterization, which can consider a whole interface or even multiple interfaces, become an efficient way, especially estimating the risk of an out-of-guideline design. In this paper, a process with less human interaction is demonstrated. This method can relief the burden in choosing the representative channel from the layout and allow the designer to focus in improving the layout quality in these problematic areas.
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系统级互连电气性能表征
在PC/服务器行业中,仿真过程通常分为布局前和布局后两个阶段。预布局仿真的重点是寻找解空间或选择更好的拓扑[1],[2]。在布局后仿真中,广泛采用提取3对或5对信道模型并进行仿真分析的方法。但是,它需要对布局有基本的了解。否则,所提取的信道可能不是代表现实中最坏情况的最佳信道。系统级互连电气性能的表征,可以考虑整个接口甚至多个接口,成为一种有效的方法,特别是评估设计偏离准则的风险。在本文中,演示了一个较少人为交互的过程。这种方法可以减轻从版面中选择代表性通道的负担,使设计师能够集中精力提高这些问题区域的版面质量。
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