L. Lanzerotti, N. Feilchenfeld, D. Coolbaugh, James A. Slinkman, P. Gray, David C. Sheridan, J. Higgins, W. Hodge, M. Gordon, T. Larsen, M. Gautsch, P. Lindgren, R. Murty, J. Rascoe, Kimball M. Watson, T. Stamper, E. Eshun, J. He, K. Downes, R. Rassel, J. Greco, B. Labelle, S. Sweeney, Kenneth J. Stein, R. Bolam, K. Vaed, B. Omer, Alvin J. Joseph, S. S. Onge, J. Dunn
{"title":"A low complexity 0.13 /spl mu/ SiGe BiCMOS technology for wireless and mixed signal applications","authors":"L. Lanzerotti, N. Feilchenfeld, D. Coolbaugh, James A. Slinkman, P. Gray, David C. Sheridan, J. Higgins, W. Hodge, M. Gordon, T. Larsen, M. Gautsch, P. Lindgren, R. Murty, J. Rascoe, Kimball M. Watson, T. Stamper, E. Eshun, J. He, K. Downes, R. Rassel, J. Greco, B. Labelle, S. Sweeney, Kenneth J. Stein, R. Bolam, K. Vaed, B. Omer, Alvin J. Joseph, S. S. Onge, J. Dunn","doi":"10.1109/BIPOL.2004.1365789","DOIUrl":null,"url":null,"abstract":"We present IBM's next-generation, cost-performance-optimized BiCMOS technology (BiCMOS 8WL) which combines a state-of-the-art suite of SiGe NPNs, foundry compatible 0.13 μm CMOS, and a rich set of modular passive devices. Intended for a wide variety of supply voltages, the technology, features three different performance NPNs and standard, dual oxide, zero V t , and junction isolated FETs. Optimized for wireless and mixed signal applications, BiCMOS 8WL will enable system on a chip integration for 3G cellular applications.","PeriodicalId":447762,"journal":{"name":"Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BIPOL.2004.1365789","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
We present IBM's next-generation, cost-performance-optimized BiCMOS technology (BiCMOS 8WL) which combines a state-of-the-art suite of SiGe NPNs, foundry compatible 0.13 μm CMOS, and a rich set of modular passive devices. Intended for a wide variety of supply voltages, the technology, features three different performance NPNs and standard, dual oxide, zero V t , and junction isolated FETs. Optimized for wireless and mixed signal applications, BiCMOS 8WL will enable system on a chip integration for 3G cellular applications.
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