Exploiting microarchitectural redundancy for defect tolerance

P. Shivakumar, S. Keckler, C. R. Moore, D. Burger
{"title":"Exploiting microarchitectural redundancy for defect tolerance","authors":"P. Shivakumar, S. Keckler, C. R. Moore, D. Burger","doi":"10.1109/ICCD.2012.6378613","DOIUrl":null,"url":null,"abstract":"The continued increase in microprocessor clock frequency that has come from advancements in fabrication technology and reductions in feature size, creates challenges in maintaining both manufacturing yield rates and long-term reliability of devices. Methods based on defect detection and reduction may not offer a scalable solution due to cost of eliminating contaminants in the manufacturing process and increasing chip complexity. This paper proposes to use the inherent redundancy available in existing and future chip microarchitectures to improve yield and enable graceful performance degradation in fail-in-place systems. We introduce a new yield metric called performance averaged yield (Ypav) which accounts both for fully functional chips and those that exhibit some performance degradation. Our results indicate that at 250nm we are able to increase the Ypav of a uniprocessor with only redundant rows in its caches from a base value of 85% to 98% using microarchitectural redundancy. Given constant chip area, shrinking feature sizes increases fault susceptibility and reduces the base Ypav to 60% at 50nm, which exploiting microarchitectural redundancy then increases to 99.6%.","PeriodicalId":313428,"journal":{"name":"2012 IEEE 30th International Conference on Computer Design (ICCD)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"85","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 30th International Conference on Computer Design (ICCD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2012.6378613","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 85

Abstract

The continued increase in microprocessor clock frequency that has come from advancements in fabrication technology and reductions in feature size, creates challenges in maintaining both manufacturing yield rates and long-term reliability of devices. Methods based on defect detection and reduction may not offer a scalable solution due to cost of eliminating contaminants in the manufacturing process and increasing chip complexity. This paper proposes to use the inherent redundancy available in existing and future chip microarchitectures to improve yield and enable graceful performance degradation in fail-in-place systems. We introduce a new yield metric called performance averaged yield (Ypav) which accounts both for fully functional chips and those that exhibit some performance degradation. Our results indicate that at 250nm we are able to increase the Ypav of a uniprocessor with only redundant rows in its caches from a base value of 85% to 98% using microarchitectural redundancy. Given constant chip area, shrinking feature sizes increases fault susceptibility and reduces the base Ypav to 60% at 50nm, which exploiting microarchitectural redundancy then increases to 99.6%.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
利用微架构冗余来容忍缺陷
由于制造技术的进步和特征尺寸的缩小,微处理器时钟频率的持续增加给保持设备的制造良率和长期可靠性带来了挑战。由于在制造过程中消除污染物的成本和芯片复杂性的增加,基于缺陷检测和减少的方法可能无法提供可扩展的解决方案。本文提出利用现有和未来芯片微架构中可用的固有冗余来提高成品率,并使故障就地系统的性能下降变得优雅。我们引入了一个新的良率指标,称为性能平均良率(Ypav),它既考虑了功能齐全的芯片,也考虑了那些表现出一些性能下降的芯片。我们的结果表明,在250nm时,我们能够使用微架构冗余将缓存中只有冗余行的单处理器的Ypav从基础值85%提高到98%。在芯片面积不变的情况下,缩小特征尺寸会增加故障敏感性,并将50nm的基本Ypav降低到60%,而利用微架构冗余的基本Ypav则增加到99.6%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Oblivious routing design for mesh networks to achieve a new worst-case throughput bound WaveSync: A low-latency source synchronous bypass network-on-chip architecture Integration of correct-by-construction BIP models into the MetroII design space exploration flow Dynamic phase-based tuning for embedded systems using phase distance mapping A comparative study of wearout mechanisms in state-of-art microprocessors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1