Impact of dielectric capping layer thickness on the contact formation between n+-type passivating contacts and screen-printed fire-through silver pastes
B. Min, N. Wehmeier, Till Brendemuehl, F. Haase, Y. Larionova, L. Nasebandt, H. Schulte‐Huxel, R. Peibst, R. Brendel
{"title":"Impact of dielectric capping layer thickness on the contact formation between n+-type passivating contacts and screen-printed fire-through silver pastes","authors":"B. Min, N. Wehmeier, Till Brendemuehl, F. Haase, Y. Larionova, L. Nasebandt, H. Schulte‐Huxel, R. Peibst, R. Brendel","doi":"10.1063/5.0089239","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":403678,"journal":{"name":"SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"SiliconPV 2021, The 11th International Conference on Crystalline Silicon Photovoltaics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/5.0089239","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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