PA7300LC integrates cache for cost/performance

D. Hollenbeck, S. Undy, Leith Johnson, D. Weiss, P. Tobin, Richard Carlson
{"title":"PA7300LC integrates cache for cost/performance","authors":"D. Hollenbeck, S. Undy, Leith Johnson, D. Weiss, P. Tobin, Richard Carlson","doi":"10.1109/CMPCON.1996.501764","DOIUrl":null,"url":null,"abstract":"HP continues its development of low cost, high performance processors with an evolution of the PA7100LC which includes 128 kB of on-chip primary cache. It implements the full PA-RISC1.1 functionality including the little-endian, uncacheable memory, and multimedia extensions of the PA7100LC. The PA7300LC connects directly to an optional second level cache of 256 kB to 64 MB using plug-in cards. It also adds the ability to accelerate I/O stores to certain memory locations for greatly improved graphics performance. The cache system consists of on-chip, 2-way, separate instruction and data caches of 64 kB total each, plus the off-chip second level cache. Memory consists of 8 MB to 3.75 GB of standard DRAMs or SIMMs connecting directly to the processor chip, using either a 72 bit or 144 bit data path. The chip is fabricated in 0.5 micron, 4-level metal CMOS and is designed to run at frequencies up to 160 MHz. The PA7300LC exceeds performance levels of previous generation high-end workstations while lowering overall system cost and power consumption.","PeriodicalId":117038,"journal":{"name":"COMPCON '96. Technologies for the Information Superhighway Digest of Papers","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"COMPCON '96. Technologies for the Information Superhighway Digest of Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CMPCON.1996.501764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

HP continues its development of low cost, high performance processors with an evolution of the PA7100LC which includes 128 kB of on-chip primary cache. It implements the full PA-RISC1.1 functionality including the little-endian, uncacheable memory, and multimedia extensions of the PA7100LC. The PA7300LC connects directly to an optional second level cache of 256 kB to 64 MB using plug-in cards. It also adds the ability to accelerate I/O stores to certain memory locations for greatly improved graphics performance. The cache system consists of on-chip, 2-way, separate instruction and data caches of 64 kB total each, plus the off-chip second level cache. Memory consists of 8 MB to 3.75 GB of standard DRAMs or SIMMs connecting directly to the processor chip, using either a 72 bit or 144 bit data path. The chip is fabricated in 0.5 micron, 4-level metal CMOS and is designed to run at frequencies up to 160 MHz. The PA7300LC exceeds performance levels of previous generation high-end workstations while lowering overall system cost and power consumption.
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PA7300LC集成了高性价比的高速缓存
惠普继续开发低成本、高性能的处理器,PA7100LC的演进包括128kb片上主缓存。它实现了完整的PA-RISC1.1功能,包括PA7100LC的小端、不可缓存内存和多媒体扩展。PA7300LC使用插件卡直接连接到256 kB到64 MB的可选二级缓存。它还增加了加速I/O存储到特定内存位置的能力,从而大大提高了图形性能。缓存系统由片上,2路,独立的指令和数据缓存组成,每个缓存总共64kb,加上片外二级缓存。内存由8mb到3.75 GB的标准dram或simm组成,直接连接到处理器芯片,使用72位或144位数据路径。该芯片由0.5微米、4级金属CMOS制成,设计工作频率高达160 MHz。PA7300LC超越了上一代高端工作站的性能水平,同时降低了整体系统成本和功耗。
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