Y. Li, J. Popelek, J. Rhee, L. Wang, T. Wang, K. Shum
{"title":"Demonstration of fiber-based board-level optical clock distributions","authors":"Y. Li, J. Popelek, J. Rhee, L. Wang, T. Wang, K. Shum","doi":"10.1109/MPPOI.1998.682147","DOIUrl":null,"url":null,"abstract":"Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13/spl times/19 cm/sup 2/ are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed.","PeriodicalId":248808,"journal":{"name":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","volume":"14 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MPPOI.1998.682147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
Embedding of end-tapered, thin-cladding fiber bundles for board-level large bandwidth optical clock distributions is proposed and demonstrated. Fan-outs of up to 128-nodes on a printed circuit board of area as large as 13/spl times/19 cm/sup 2/ are experimentally demonstrated. Both silica and polymer fibers were tested. Performance parameters, such as fiber bending loss, attenuations, dispersions, coupling loss and uniformity were measured. Embedding of fibers on a double-layered chip-populated real PCB was performed.
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