A pixel readout chip in 40 nm CMOS process for high count rate imaging systems with minimization of charge sharing effects

P. Maj, P. Grybos, R. Szczygiel, P. Kmon, A. Drozd, Grzegorz Deptuch
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引用次数: 6

Abstract

We present a prototype chip built in a 40 nm CMOS process for readout of a pixel detector. The prototype chip has a matrix of 18×24 pixels with a pixel pitch of 100 μm. It can operate in both: the single photon counting (SPC) mode and the C8P1 mode. In the SPC mode using the high gain setting the measured ENC is 84 e- rms (for the peaking time of 48 ns), the gain is 79.7 μV/e-, while the effective offset spread is 24 e- rms. In the C8P1 mode, the chip reconstructs full charge deposited in the detector, despite the charge sharing, and it points to a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.
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一种用于高计数率成像系统的40nm CMOS制程像素读出芯片,具有最小的电荷共享效应
我们提出了一个基于40纳米CMOS工艺的像素检测器读出原型芯片。该原型芯片的像素矩阵为18×24,像素间距为100 μm。它可以在两种模式下工作:单光子计数(SPC)模式和C8P1模式。在采用高增益设置的SPC模式下,测得ENC为84 e- rms(峰值时间为48 ns),增益为79.7 μV/e-,有效失调扩展为24 e- rms。在C8P1模式下,尽管存在电荷共享,但芯片重构了沉积在检测器中的全部电荷,并指向电荷沉积最大的像素。报告了芯片结构和初步测量结果。
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