{"title":"Key challenges in practical realization of Si photonics products","authors":"M. Asghari, B. Luff, D. Feng, J. Fong","doi":"10.1109/LEOSWT.2008.4444380","DOIUrl":null,"url":null,"abstract":"In this paper we review the key challenges associated with the successful development of Si photonic products. These will include issues such as device performance, wafer fabrication, on chip assembly and product packaging.","PeriodicalId":114191,"journal":{"name":"2008 IEEE/LEOS Winter Topical Meeting Series","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE/LEOS Winter Topical Meeting Series","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSWT.2008.4444380","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper we review the key challenges associated with the successful development of Si photonic products. These will include issues such as device performance, wafer fabrication, on chip assembly and product packaging.
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