Boundary scan adaption for active substrate MCM-test

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334) Pub Date : 1997-09-07 DOI:10.1109/ASIC.1997.616979

H. Werkmann, B. Hofflinger, B. Laquai

引用次数: 2

Abstract

A MCM test strategy using boundary scan-cells integrated into silicon substrates is presented. The differences between IC-based boundary scan and active substrate boundary scan and their effects on scan-cell placement and design are highlighted. A yield optimized partition of the test circuitry and an adaption to commercially available boundary scan test systems is proposed. Active substrates with boundary scan test capabilities are fabricated based on the identified requirements. The adaption to the test system is evaluated.

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有源衬底mcm测试的边界扫描自适应

提出了一种集成在硅衬底上的边界扫描单元的MCM测试策略。强调了基于集成电路的边界扫描与有源衬底边界扫描之间的差异及其对扫描单元放置和设计的影响。提出了一种良率优化的测试电路划分方法和一种适用于商用边界扫描测试系统的方法。具有边界扫描测试能力的有源基板是根据确定的要求制造的。对测试系统的适应性进行了评价。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)

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