3DMemory — Memory usage analysis tool

A. Schönberger, K. Hofmann
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引用次数: 2

Abstract

Die-stacking technology is opening up new options for memory system design. Through silicon vias (TSV) provide a configurable interface between memory and processing unit and allow a high bandwidth. System performance can be increased significantly by a sophisticated DRAM architecture design. This paper presents a framework providing a design recommendation for memory based on application execution data. The analysis approach can be adapted for different system configurations and applications. In this work a single-core execution of JPEG2000 algorithm for different picture sizes is analyzed with the tool.
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3DMemory -内存使用分析工具
模堆技术为存储系统设计开辟了新的选择。通过硅通孔(TSV)提供存储器和处理单元之间的可配置接口,并允许高带宽。复杂的DRAM架构设计可以显著提高系统性能。本文提出了一个基于应用程序执行数据的内存设计建议框架。分析方法可以适应不同的系统配置和应用程序。本文利用该工具分析了JPEG2000算法在不同图像尺寸下的单核执行情况。
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