Voltage and Temperature Scalable Standard Cell Leakage Models Based on Stacks for Statistical Leakage Characterization

Janakiraman Viraraghavan, B. P. Das, B. Amrutur
{"title":"Voltage and Temperature Scalable Standard Cell Leakage Models Based on Stacks for Statistical Leakage Characterization","authors":"Janakiraman Viraraghavan, B. P. Das, B. Amrutur","doi":"10.1109/VLSI.2008.38","DOIUrl":null,"url":null,"abstract":"With extensive use of dynamic voltage scaling (DVS) there is increasing need for voltage scalable models. Similarly, leakage being very sensitive to temperature motivates the need for a temperature scalable model as well. We characterize standard cell libraries for statistical leakage analysis based on models for transistor stacks. Modeling stacks has the advantage of using a single model across many gates there by reducing the number of models that need to be characterized. Our experiments on 15 different gates show that we needed only 23 models to predict the leakage across 126 input vector combinations. We investigate the use of neural networks for the combined PVT model, for the stacks, which can capture the effect of inter die, intra gate variations, supply voltage(0.6-1.2 V) and temperature (0 - 100degC) on leakage. Results show that neural network based stack models can predict the PDF of leakage current across supply voltage and temperature accurately with the average error in mean being less than 2% and that in standard deviation being less than 5% across a range of voltage, temperature.","PeriodicalId":143886,"journal":{"name":"21st International Conference on VLSI Design (VLSID 2008)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-01-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st International Conference on VLSI Design (VLSID 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI.2008.38","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

With extensive use of dynamic voltage scaling (DVS) there is increasing need for voltage scalable models. Similarly, leakage being very sensitive to temperature motivates the need for a temperature scalable model as well. We characterize standard cell libraries for statistical leakage analysis based on models for transistor stacks. Modeling stacks has the advantage of using a single model across many gates there by reducing the number of models that need to be characterized. Our experiments on 15 different gates show that we needed only 23 models to predict the leakage across 126 input vector combinations. We investigate the use of neural networks for the combined PVT model, for the stacks, which can capture the effect of inter die, intra gate variations, supply voltage(0.6-1.2 V) and temperature (0 - 100degC) on leakage. Results show that neural network based stack models can predict the PDF of leakage current across supply voltage and temperature accurately with the average error in mean being less than 2% and that in standard deviation being less than 5% across a range of voltage, temperature.
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基于堆栈的电压和温度可扩展标准电池泄漏模型的统计泄漏表征
随着动态电压缩放(DVS)的广泛使用,对电压可缩放模型的需求日益增加。同样,泄漏对温度非常敏感,这也激发了对温度可伸缩模型的需求。我们描述了基于晶体管堆模型的统计泄漏分析的标准单元库。建模堆栈的优点是通过减少需要表征的模型的数量,在许多门上使用单个模型。我们在15个不同门上的实验表明,我们只需要23个模型来预测126个输入向量组合的泄漏。我们研究了将神经网络用于组合PVT模型,用于堆栈,该模型可以捕获芯片间,栅极内变化,电源电压(0.6-1.2 V)和温度(0 - 100℃)对泄漏的影响。结果表明,基于神经网络的堆栈模型可以准确预测电源电压和温度范围内的泄漏电流PDF,其平均值误差小于2%,标准差误差小于5%。
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