SU-8 On Pmma - A New Technology For Microfluidics

T. Truong, N. Nguyen
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引用次数: 5

Abstract

Conventional SU-8 lithography process for fabricating microfluidic devices ofthe uses silicon or glass as wafer materials. Since silicon and glass are hard and brittle, drilling fluid access holes or dicing the wafers into individual devies are difficult. We investigated the use of polymethylmethacrylate (PMMA) as a new wafer material. PMMA, an amorphous thermoplastic, was chosen for being easy to drill or cut, biocompatible, transparent, and much cheaper than silicon or glass wafers. Moreover, is thermal expansion coefficient ideally matches that of SU-8. PMMA poorly resists solvents, and has low glass transition temperature (105°C). Thus, the conventional process needed to be modified. The wafer was only cleaned with isopropyl alcohol and deionized water. The baking temperature was lowered to 90°C. In addition, a "base layer" of SU-8, helping to achieve a high quality structural pattern, was coated before coating the actual structural SU-8 layer. A Tesla valve, a non-moving part microfluidic valve, was successfully fabricated in SU-8 using thr presented process,. However, the PMMA wafer bowed ue to the thermal residual during baking steps. Despite the bowing which can be solved by increasing wafer thickness, we conclude that PMMA is a promising wafer material for a SU-8 process.
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微流控新技术——Pmma的SU-8
传统的SU-8光刻工艺是用硅或玻璃作为晶圆材料来制造微流控器件的。由于硅和玻璃又硬又脆,钻井液进入孔或将晶圆切割成单独的器件是困难的。研究了聚甲基丙烯酸甲酯(PMMA)作为新型硅片材料的应用。PMMA是一种无定形热塑性塑料,选择它是因为它易于钻孔或切割,具有生物相容性,透明,而且比硅或玻璃晶圆便宜得多。其热膨胀系数与SU-8的热膨胀系数基本吻合。PMMA耐溶剂性差,玻璃化转变温度低(105°C)。因此,需要对传统工艺进行修改。晶圆片仅用异丙醇和去离子水清洗。烘烤温度降至90℃。此外,在涂覆实际的结构SU-8层之前,先涂覆SU-8的“基础层”,以帮助实现高质量的结构图案。采用该工艺,在SU-8上成功制备了非运动部件微流控阀Tesla阀。然而,在烘烤过程中,PMMA晶圆由于热残余而弯曲。尽管可以通过增加晶圆厚度来解决弯曲问题,但我们得出结论,PMMA是一种有前途的SU-8工艺晶圆材料。
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