Cross-Layer Resilience: Challenges, Insights, and the Road Ahead

E. Cheng, Daniel Mueller-Gritschneder, J. Abraham, P. Bose, A. Buyuktosunoglu, Deming Chen, Hyungmin Cho, Yanjing Li, Uzair Sharif, K. Skadron, M. Stan, Ulf Schlichtmann, S. Mitra
{"title":"Cross-Layer Resilience: Challenges, Insights, and the Road Ahead","authors":"E. Cheng, Daniel Mueller-Gritschneder, J. Abraham, P. Bose, A. Buyuktosunoglu, Deming Chen, Hyungmin Cho, Yanjing Li, Uzair Sharif, K. Skadron, M. Stan, Ulf Schlichtmann, S. Mitra","doi":"10.1145/3316781.3323474","DOIUrl":null,"url":null,"abstract":"Resilience to errors in the underlying hardware is a key design objective for a large class of computing systems, from embedded systems all the way to the cloud. Sources of hardware errors include radiation, circuit aging, variability induced by manufacturing and operating conditions, manufacturing test escapes, and early-life failures. Many publications have suggested that cross-layer resilience, where multiple error resilience techniques from different layers of the system stack cooperate to achieve cost-effective resilience, is essential for designing cost-effective resilient digital systems. This paper presents a comprehensive overview of cross-layer resilience by addressing fundamental cross-layer resilience questions, by summarizing insights derived from recent advances in cross-layer resilience research, and by discussing future cross-layer resilience challenges.","PeriodicalId":391209,"journal":{"name":"Proceedings of the 56th Annual Design Automation Conference 2019","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 56th Annual Design Automation Conference 2019","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3316781.3323474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Resilience to errors in the underlying hardware is a key design objective for a large class of computing systems, from embedded systems all the way to the cloud. Sources of hardware errors include radiation, circuit aging, variability induced by manufacturing and operating conditions, manufacturing test escapes, and early-life failures. Many publications have suggested that cross-layer resilience, where multiple error resilience techniques from different layers of the system stack cooperate to achieve cost-effective resilience, is essential for designing cost-effective resilient digital systems. This paper presents a comprehensive overview of cross-layer resilience by addressing fundamental cross-layer resilience questions, by summarizing insights derived from recent advances in cross-layer resilience research, and by discussing future cross-layer resilience challenges.
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跨层弹性:挑战、见解和未来之路
对于从嵌入式系统到云计算的大型计算系统来说,底层硬件对错误的弹性是一个关键的设计目标。硬件错误的来源包括辐射、电路老化、由制造和操作条件引起的变异性、制造测试逃逸和早期寿命故障。许多出版物都提出,跨层弹性对于设计具有成本效益的弹性数字系统至关重要,跨层弹性是来自系统堆栈不同层的多种错误弹性技术合作以实现具有成本效益的弹性。本文通过解决基本的跨层弹性问题,总结跨层弹性研究的最新进展,并讨论未来的跨层弹性挑战,对跨层弹性进行了全面的概述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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