Theoretical analysis of buffer trapping effects on off-state breakdown between gate and drain in AlGaN/GaN HEMTs

Lin Zhu, Jinyan Wang, Haisang Jiang, Hongyue Wang, Wengang Wu, Yang Zhou, Gang Dai
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引用次数: 6

Abstract

In this paper, AlGaN/GaN HEMTs with different device dimensions were designed and fabricated to investigate the relationship between off-state breakdown voltage and gate-to-drain spacing. It is found that the off-state breakdown voltage increases almost linearly with gate-to-drain spacing with the slop of about 46.8V/gm. Sentaurus software was used to find the physical mechanism of this phenomenon. By comparing the simulation results of devices with and without deep-level acceptor traps in GaN buffer layer, it is found that the deep-level acceptor traps in GaN buffer layer underneath the gate-to-drain channel could be occupied by hot electrons created in channel, which would extend the channel depletion region and then alleviate the maximum channel electric field. The theoretical and simulation analysis show that there is a positive correlation between the depletion length and the off-state gate-drain breakdown voltage. The simulation results show that with gate-to-drain spacing increasing, the negatively charged buffer traps region spread wider and the depletion region length becomes longer, playing a key role in the linear dependence of off-state gate-drain breakdown voltage on gate-to-drain spacing.
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AlGaN/GaN hemt栅极与漏极失态击穿缓冲捕集效应的理论分析
本文设计并制作了不同器件尺寸的AlGaN/GaN hemt,研究了脱态击穿电压与栅极-漏极间距的关系。结果表明,失态击穿电压随栅极-漏极间距几乎呈线性增加,斜率约为46.8V/gm。Sentaurus软件被用来寻找这种现象的物理机制。通过对比GaN缓冲层中存在和不存在深层受体陷阱的器件的仿真结果,发现栅极-漏极通道下方的GaN缓冲层中深层受体陷阱可以被通道中产生的热电子占据,从而扩大了通道耗尽区域,从而缓解了最大通道电场。理论分析和仿真分析表明,耗尽长度与断态栅漏击穿电压呈正相关。仿真结果表明,随着栅极-漏极间距的增大,带负电荷的缓冲陷阱区域扩展得更宽,耗尽区长度变长,这对栅极-漏极击穿电压与栅极-漏极间距的线性关系起着关键作用。
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