{"title":"Time-domain scattering method using triangle impulse responses for modeling electronic packaging components","authors":"Zhaoqing Chen, A. Ruehli","doi":"10.1109/EPEP.2001.967609","DOIUrl":null,"url":null,"abstract":"This paper describes a time-domain scattering method using triangle impulse response for modeling electronic packaging components such as connectors and vias. The method provides a direct data interface for linear component models to time-domain EM/circuit simulation tools.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
This paper describes a time-domain scattering method using triangle impulse response for modeling electronic packaging components such as connectors and vias. The method provides a direct data interface for linear component models to time-domain EM/circuit simulation tools.
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