{"title":"Defects Detection in PCB with Ground Plane by Clustering and Flood-fill Algorithms","authors":"R. Melnyk, Yurii Havrylko, Mariia Levytska","doi":"10.1109/aict52120.2021.9628899","DOIUrl":null,"url":null,"abstract":"The known K-means clustering and flood-fill algorithms are implemented. To reduce the color number multilevel segmentation by clustering algorithm is realized. A number of levels are taken from user. The etalon PCB image can be used to determine coordinate of pixels forming contacts. The flood-fill algorithm is used to mark contacts, traces and ground plane. The flood-fill algorithm also is used to control contacts of chains. The model of marked chains is being used to detect defects of shot and open in the manufactured PCB.","PeriodicalId":375013,"journal":{"name":"2021 IEEE 4th International Conference on Advanced Information and Communication Technologies (AICT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 4th International Conference on Advanced Information and Communication Technologies (AICT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/aict52120.2021.9628899","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The known K-means clustering and flood-fill algorithms are implemented. To reduce the color number multilevel segmentation by clustering algorithm is realized. A number of levels are taken from user. The etalon PCB image can be used to determine coordinate of pixels forming contacts. The flood-fill algorithm is used to mark contacts, traces and ground plane. The flood-fill algorithm also is used to control contacts of chains. The model of marked chains is being used to detect defects of shot and open in the manufactured PCB.