Analyses of strips metallization effect on the delay time of integrated circuit elements

H. Bourdoucen, A. Issaoun, M. Djeddi
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Abstract

The quasi-static parameters of planar lossless multiconductor transmission line systems are computed using the semianalytical method of lines with nonequidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of one, two, and five strips in a two-layer dielectric medium is taken into account. The propagation delay which is related to the inductance and capacitance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay with respect to zero thickness approximation time delay for the structures studied reach about 20% for t/w of 30%.<>
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带状金属化对集成电路元件延迟时间的影响分析
采用非等距离散的半解析方法,计算了平面无损多导体传输线系统的准静态参数。考虑了两层介质中金属化厚度对1条、2条和5条电容和电感矩阵的影响。与这些结构的电感和电容矩阵有关的传输延迟受导体带金属化厚度的影响很大。当t/w为30%时,该时滞相对于所研究结构的零厚度近似时滞的相对变化约为20%。
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