HARS: A High-Performance Reliable Routing Scheme for 3D NoCs

Abstract

The poor yield of current available processes for Through-Silicon Via (TSV) fabrication leads to serious influence on the robustness of the vertical communications in 3D NoCs. The fault-tolerant routing scheme has been regarded as an effective mechanism to ensure the performance of 2D NoCs. In this paper, we propose a high-performance reliable routing scheme HARS, which is deadlock-free by obeying a mid-node-searching method raised for 3D Mesh NoCs without requiring any Virtual Channels (VCs). In HARS, we adopt DyADM routing, extending the classical 2D routing algorithm DyAD to 3D scenario in presence of permanent faults on the vertical links. HARS is able to support both one-fault and multi-fault models. The experimental results show that HARS has better performance, improved reliability and lower overhead compared to the state-of-the-art reliable routing schemes.