Low Energy Light Ion Sputtering of Metals and Carbides

J. Roth, J. Bohdansky, A. Martinelli
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引用次数: 58

Abstract

Abstract For a great number of ion-target combinations similarities in low energy sputtering have been found. 11Near the threshold energy for sputtering E th, the energy dependence of the sputtering yield can be written as S = Y (E/E th)1/4 (1 – E h/E)7/2, E th and Y depend only on the surface binding energy E B and the ion-target atom mass ratio. Using this relation the energy dependence of the sputtering yield of B4C, SiC, TiC, TaC, WC is compared with the yields from S, Si, Ti, Ta, W, for H, D and He in the energy range of 50 eV to 8 keV. A strong similarity of the energy dependence, i.e. Eth , and Y, can be found between the carbide and the heavier component of the compound. This leads to the assumption, that the target surface is depleted of the light component due to preferential sputtering and the sputtering process is dominated by the heavy component.
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金属和碳化物的低能光离子溅射
摘要对于大量的离子靶组合,人们发现了低能溅射的相似之处。11在溅射阈值能量E th附近,溅射产率的能量依赖关系可写成S = Y (E/E th)1/4 (1 - E h/E)7/2, E th和Y仅依赖于表面结合能E B和离子-靶原子质量比。利用这一关系式,比较了B4C、SiC、TiC、TaC、WC的溅射产率与S、Si、Ti、Ta、W、H、D、He在50 eV ~ 8 keV能量范围内的产率的能量依赖性。在碳化物和化合物中较重的组分之间,能量依赖性(即Eth和Y)具有很强的相似性。这导致假设,由于优先溅射,目标表面的轻组分被耗尽,溅射过程由重组分主导。
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