Design and Technology Solutions for 3D Integrated High Performance Systems

Abstract

3D system integration builds on interconnect scaling roadmaps of TSVs (5µm to 100nm CD) and fine pitch bumps/pads (to <1µm pitch) for D2W and W2W schemes. Si bridges connect chiplets at 9.5Gbp, 338fJ/b, while W2W fine pitch memory logic functional partitioning improves power/performance by 30% vs 2D. Impingement cooler, BSPDN, high density MIMCAP and integrated magnetics push the power wall to 300W/cm2. On the other hand, 3D design flows require further development. Process optimization, DfT, KGD/S and heterogeneous technology optimization of functionally partitioned 3D-SOC make high performance systems cost-effective.